Toolika Srivastava was born in Uttar Pradesh, India. She received her B.Tech degree in Electronics and Communication Engineering in 2012 and M.Tech degree from Madan Mohan Malaviya University of Technology, Gorakhpur, Uttar Pradesh, India in 2015. Currently she is working as Assistant Professor in E&C Engineering Department in Bundelkhand Univeristy, Jhansi. Her area of interest for research is Microwave Engineering and antennas. 

[1]. Toolika Srivastava, Chandan and B.S.Rai, “High Gain Multiband U-Slot Patch Antenna with Defected Ground Plane”   i-manager’s Journal on Communication Engineering and Systems, Vol. 4, No. 1, November 2014 - January 2015, ISSN: 2277-5102.   

[2]. Toolika Srivastava, Chandan and B.S.Rai, “Microstrip line-fed patch antenna for UWB applications,” i-manager’s Journal on Wireless Communication Network, Vol. 4, No. 1, April - June 2015, ISSN: 2319-4839.

[3]. Chandan, Toolika Srivastava and B.S.Rai, “Multiband Monopole U-Slot Patch Antenna with Truncated Ground Plane,” Microwave and Optical Technology Letters (MOTL), Vol. 58, No. 8, pp. 1949-1952.[SCI, Thomson Reuters Impact Factor: 0.545]

[4]. Toolika Srivastava, Shankul Saurabh, Anupam Vyas and Rajan Mishra, “A Triple Band $ Shape Slotted PIFA for 2.4 GHz and 5 GHz WLAN Applications,” Springer conference SOCTA 2017

[5].  Chandan, G.D.Bharti, Toolika Srivastava and B.S.Rai, “Dual Band Monopole Antenna for WLAN 2.4/5.2/5.8 with Truncated Ground,” ICEEMAS SVIIT Conference on Hyderabad, in press [Book Chapter + Scopus + DBLP].